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Releases: MSTRocketDesignTeam/Avionics-Telemetry-PCB

v3.0.0

11 Dec 22:36

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Third production version of the board, replaced STM32 with 144 pin version (was in stock).

Rev 1 & 2 had the Switching Mode Power Supply (SMPS) pins of the uController connected to VCC, as indicated in the datasheet. The datasheet also says later on that these pins are never to exceed like 2.5V. We were connecting them to a VCC of 3.3V, which overvolted the internal regulator of the SMPS, and would cause it to eventually fail catastrophically. New chip does not include SMPS feature, as it wasn't used anyway.

Ordered for production from JLCPCB on 12/11/2022.

v2.0.0

26 Mar 18:43

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Second production version of the board, fixed chip grounding issue.
Ordered for production from JLCPCB on 03/24/2022.

What's Changed

Full Changelog: v1.0.0...v2.0.0

v1.0.0

24 Jan 18:12

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First production version of the board.
First ordered for production from JLCPCB on 1/24/2022.

v0.3.5

19 Jan 07:03

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v0.3.5 Pre-release
Pre-release
Git oopsie

v0.3.3

19 Jan 06:39
e7a9738

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v0.3.3 Pre-release
Pre-release

Added the following:

  • Larger crystal footprints for parts in stock
  • Added reset button to NRST line
  • Added header pins for bootloader toggling
  • Updated documentation and project settings
  • Added 3D models for all components

v0.3.2

18 Jan 07:41

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v0.3.2 Pre-release
Pre-release

Added LEDs and silk screen art

v0.3.1

17 Jan 09:03

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v0.3.1 Pre-release
Pre-release

Small tweak.

  • Connected some unconnected GND stitching vias.

v0.3.0

17 Jan 08:54
71cacdf

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v0.3.0 Pre-release
Pre-release

Major improvements to PCB Layout and interference prevention.

  • Copper ground pours on F and B.
  • Improved isolation between data lines
  • Expanded via fences around RF section.
  • GND plane isolation peninsulas for crystals.
  • Simplified I2C, SPI, and USB lines for reduced interference.
  • Added 3D models for all components.
  • Adjusted positions of RF components for improved impedance matching.
  • RF components to 0402 package from 0603 for improved impedance matching.
  • Traces for RF section have rounded corners to help improve impedance matching and reduce interference.
  • Moved silkscreen labels to outside via fence for improved legibility.
  • Improved trace thicknesses for power delivery.
  • Updated libraries to include those found in other RDT modules.
  • Modified board dimensions to match other RDT modules.

v0.2.2

20 Dec 21:26

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v0.2.2 Pre-release
Pre-release

Same as previous release but with corrected copper pours around RF section

v0.2.1

20 Dec 20:26

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v0.2.1 Pre-release
Pre-release

Like the last release, but corrected the silk screen and added pcb extensions.