Skip to content

Hardware Roadmap

Ben Hefner edited this page Sep 19, 2017 · 6 revisions

Previous Revisions

8.0.0 (latest)

  • Board layering architecture. Provides a framework for developing compatible boards that connect by (1) stacking boards, (2) wireless communication channels, or (3) wired connections via GPIO or stacking connector jumper cables.
  • Battery component/layer
  • Compute component/layer
  • I/O component/layer

Future Components

  • camera (for use in potentially multi-camera systems)
  • audio I/O (speaker, mic)
  • voice I/O (possible specialization of audio I/O component)
  • screen
  • button attachment

Clone this wiki locally